This letter showcases the successful fabrication of an enhancement-mode (E-mode) buried p-channel GaN field-effect-transistor on a standard p-GaN/AlGaN/GaN-on-Si power HEMT substrate. The transistor exhibits a threshold voltage (V_TH) of ?3.8 V, a maximum ON-state current (I_ON) of 1.12 mA/mm, and an impressive I_ON/I_OFF ratio of 10⁷. To achieve these remarkable results, an H plasma treatment was strategically applied to the gated p-GaN region, where a relatively thick GaN layer (i.e., 70 nm) was kept intact without aggressive gate recess. Through this treatment, the top portion of the GaN layer was converted to be hole-free, leaving only the bottom portion p-type and spatially separated from the etched GaN surface and gate-oxide/GaN interface. This approach allows for E-mode operation while retaining high-quality p-channel characteristics.

采用脉冲直流磁控溅射法在Si（100）衬底上制备了AlN/Mo/Sc_0.2Al_0.8N复合结构薄膜，在该结构上通过金属有机化学气相沉积（MOCVD）技术进行GaN薄膜的外延。使用原子力显微镜、高分辨X射线衍射、粉末X射线衍射、扫描电子显微镜和拉曼光谱研究了Mo插入层的厚度对Sc_0.2Al_0.8N缓冲层和GaN外延层晶体质量的影响，研究了Sc_0.2Al_0.8N缓冲层对Mo上生长的GaN外延层的影响。研究结果表明，Mo插入层的厚度是影响Sc_0.2Al_0.8N缓冲层和GaN外延层的重要因素，Sc_0.2Al_0.8N缓冲层对Mo上GaN晶体质量的提高具有重要意义。随Mo厚度的增加，Sc_0.2Al_0.8N缓冲层的表面粗糙度先减小后增大，GaN外延层的（002）面X射线衍射摇摆曲线半峰全宽先减小后增大。当Mo插入层厚度为400 nm时，GaN外延层的晶体质量最好，GaN（002）面的X射线衍射摇摆曲线半峰全宽为0.51°，由拉曼光谱计算得到的压应力483.09 MPa；直接在Mo上进行GaN的外延，GaN（002）面的X射线衍射摇摆曲线半峰全宽无法测得，说明在Mo上进行GaN的外延需要Sc_0.2Al_0.8N缓冲层。

Homoepitaxial growth of Si-doped β-Ga₂O₃ films on semi-insulating (100) β-Ga₂O₃ substrates by metalorganic chemical vapor deposition (MOCVD) is studied in this work. By appropriately optimizing the growth conditions, an increasing diffusion length of Ga adatoms is realized, suppressing 3D island growth patterns prevalent in (100) β-Ga₂O₃ films and optimizing the surface morphology with [010] oriented stripe features. The slightly Si-doped β-Ga₂O₃ film shows smooth and flat surface morphology with a root-mean-square roughness of 1.3 nm. Rocking curves of the (400) diffraction peak also demonstrate the high crystal quality of the Si-doped films. According to the capacitance–voltage characteristics, the effective net doping concentrations of the films are 5.41 × 10¹⁵ – 1.74 × 10²⁰ cm⁻³. Hall measurements demonstrate a high electron mobility value of 51 cm²/(V·s), corresponding to a carrier concentration of 7.19 × 10¹⁸ cm⁻³ and a high activation efficiency of up to 61.5%. Transmission line model (TLM) measurement shows excellent Ohmic contacts and a low specific contact resistance of 1.29 × 10^-4 Ω·cm² for the Si-doped film, which is comparable to the Si-implanted film with a concentration of 5.0 × 10¹⁹ cm⁻³, confirming the effective Si doing in the MOCVD epitaxy.

Power electronic devices are of great importance in modern society. After decades of development, Si power devices have approached their material limits with only incremental improvements and large conversion losses. As the demand for electronic components with high efficiency dramatically increasing, new materials are needed for power device fabrication. Beta-phase gallium oxide, an ultra-wide bandgap semiconductor, has been considered as a promising candidate, and various β-Ga₂O₃ power devices with high breakdown voltages have been demonstrated. However, the realization of enhancement-mode (E-mode) β-Ga₂O₃ field-effect transistors (FETs) is still challenging, which is a critical problem for a myriad of power electronic applications. Recently, researchers have made some progress on E-mode β-Ga₂O₃ FETs via various methods, and several novel structures have been fabricated. This article gives a review of the material growth, devices and properties of these E-mode β-Ga₂O₃ FETs. The key challenges and future directions in E-mode β-Ga₂O₃ FETs are also discussed.

GaN has been widely used in the fabrication of ultraviolet photodetectors because of its outstanding properties. In this paper, we report a graphene–GaN nanorod heterostructure photodetector with fast photoresponse in the UV range. GaN nanorods were fabricated by a combination mode of dry etching and wet etching. Furthermore, a graphene–GaN nanorod heterostructure ultraviolet detector was fabricated and its photoelectric properties were measured. The device exhibits a fast photoresponse in the UV range. The rising time and falling time of the transient response were 13 and 8 ms, respectively. A high photovoltaic responsivity up to 13.9 A/W and external quantum efficiency up to 479% were realized at the UV range. The specific detectivity D^* = 1.44 × 10¹⁰ Jones was obtained at –1 V bias in ambient conditions. The spectral response was measured and the highest response was observed at the 360 nm band.

针对氮化铝微环谐振腔实现临界耦合条件困难的问题，设计并制备了氮化铝弯曲耦合微环谐振腔。分析了微环谐振腔耦合系数公式，分别阐述了多种提高耦合强度方案的优势和劣势，最终选用弯曲耦合结构来增强耦合强度，得到了在宽耦合间隙下，实现临界耦合条件的解决方案。在蓝宝石衬底上生长了高质量的氮化铝单晶薄膜，选用导电胶克服材料的不导电性，并利用电子束曝光系统将弯曲角度为40°、耦合间隙0.19 μm、波导宽度0.41 μm的微环谐振腔图形化，分析优化多项氮化铝刻蚀参数，最终将图形转移至氮化铝层，得到了耦合间隙均匀、侧壁平整的弯曲耦合氮化铝微环谐振腔。该研究为氮化铝微环谐振腔实现临界耦合条件提供了选择参考。